Over the past decade, the semiconductor industry has steadily closed in on the fundamental limits of silicon scaling. Even with EUV lithography and advanced transistor architectures, current materials struggle to deliver the performance and power efficiency required by AI, high-performance computing, and next-generation mobile devices.

Industry research groups now project that 2D semiconductors will become viable channel materials at the Ångström scale, where conventional semiconductors can no longer maintain stability or mobility. Their atomically thin geometry provides ideal electrostatic control, suppresses short-channel effects, and improves device scaling beyond what silicon can achieve.

However, widespread adoption requires reliable access to wafer-scale, defect-free monolayers. With deterministic exfoliation, Gold-Stamp™ technology offers the first practical manufacturing method that aligns with industry requirements for purity, repeatability, and scale. As companies prepare for the A-node era, 2D materials—and the ability to produce them at scale—will play a decisive role in the future of computation.

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