2D semiconductors have extraordinary potential, but traditional fabrication approaches—like mechanical exfoliation and chemical vapor deposition—struggle to achieve consistent material quality. Mechanical exfoliation produces excellent monolayers, but only in tiny flakes. CVD offers scalability, yet the resulting films typically contain high defect densities that limit device performance.

Gold-Stamp™ technology solves this problem by deterministically disassembling a bulk TMD crystal into its constituent monolayers. Because each monolayer originates from a pristine, high-quality parent crystal, defect density is reduced by up to two orders of magnitude compared to CVD-grown films. The process also scales naturally: a single crystal contains over 100,000 monolayers, enabling both research and industrial production.

By combining atomic precision with industrial scalability, Gold-Stamp™ unlocks the true potential of 2D materials for next-generation electronics, enabling researchers and semiconductor companies to explore performance far beyond silicon’s limits.

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